GD900 Thermal Paste:
Specific Gravity: 2.3 G/Cc
Thermal Conductivity: 4.8 W/M-K
Operating Temperature: -58~392 Degrees Fahrenheit
GD900 thermal paste selects much more tiny particle diameter metal oxide as the main raw materials, used for filling the gap between the heat source and heat sink device. Its outstanding performance on the CPU GPU LED will meet your high standard demand for cooling system.
Real Shot Product Picture:
Accord with RoHS and REACH environmental protection requirements. High thermal conductivity, high insulation, high temperature resistant, low oil separation, non-corrosive.
Filling the gap between heating element and the cooling device; Increasing the contact area so as to achieve the soundest thermal conductivity effect.
Method of use:
It’s normal phenomena if there is little silicone oil floating above. Please stir well before use. Keep the coated surface clean and apply directly with tools (such as scraper, finger cot, etc).
Keep children away from it. If it is swallowed or inadvertently come into eyes, ear, nose, mouth,please flush with clean water or send to hospital when necessary.
Preservation at normal temperature. Please cover it after used, avoiding impurities such as dust, that have a bad effect on thermal conductivity.
1. Please clean the surfaces of heat source (CPU) and dissipate heat device (heat sink) with dry tissues.